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FEATURES
• Advanced monolithic construction with
high frequency
ceramic and conductive materials.
• Excellent high Q characteristics.
• Support operating frequency bands up to 10GHz.
• Excellent reliability.
APPLICATIONS
Wireless communications, celluar phones,
cordless phones, pagers, etc. Micellaneous
high-frequency circuits. EMI countermeasure in
high-frequency circuits.
SPECIFICATIONS
Operating Temperature Range: -55°C to
+125°C
Storage Conditions: -40°C max, 70%RH
PRECAUTIONS
• After mounting components onto printed
circuit board,
be careful not to bend or mishandle the
board.
• When hand soldering, apply solder iron to the printed
circuit board only. Temperature of the iron tip should
not
exceed 260°C with soldering time < 3 seconds.
• Reflow soldering condition: 230°C+/5°C (260°C+/5°C
for Pb free).
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