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FEATURES
• Constructed in a rugged case to
provide optimum pick
and place operations.
• Low profile. Great for applications when space is at a
premium.
APPLICATIONS
Excellent as DC-DC Converter used in
notebook computers, PDA, cell phones, step-up or
step-down converters and flash memory.
MATERIALS CONSTRUCTION
a. Core: Ferrite DR Core
b. Base: LCP
c. Wire: Enameled Copper Wire
d. Terminal: Tinned Copper Plate
e. Adhesive: Epoxy Resin
GENERAL SPECIFICATIONS
Temperature rise: 20°C Typical at 1 rms
B0 40°C
Typical at 1 rms2
Operating Temperature: -25°C to +85°C
Storage Temperature: -40°C to +105°C
Resistance to solder heat: 260°C for 10 seconds
Rated current: Based on temperature &
DL/LOA
= 10% Typical at Isat
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